Projecon Hot Embossing Machine
Laser Cutting Capabilities
We have three laser cutting machines consisting of the following;
1 x Sei Eureka Laser equipped with optical camera registration. Cutting area of 650 x 450 mm
1 x GCC Laser Pro Laser with cutting area of 610 x 450 mm
1 x Omnisign Plus Laser with a cutting area of 1200 x 800 mm
All lasers are equipped with vacuum tables to assist with precise alignment and cutting of the printed films.
Multicam M-1212 CNC Routing
Die Cutting and Creasing
Our Die cutting equipment consisting of 2 x heavy duty cutting and creasing platens, with a cutting area of 600 x 400 mm. These robust machines are capable of cutting materials up to 1mm thick to accuracy of +-0.2mm
PX-3700 Automated SMD Pick and Place
With a wide range of SMD components, ranging from 0603 to larger sized SMT chips, even complex tasks can be flexibly assembled.
Current capability is a maximum of 20 possible feeder positions. With intelligent software, our changeover times can be reduced to a minimum.
Range of applications. Precision assembling and dispensing of low and medium volume SMT, utilising multiple camera optical registration positions.